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Millimeter-Wave Antennas and Arrays Using Printed-Circuit-Board and Plated-Through-Hole Technologies
时间:2017-10-10 10:49    点击:   所属单位:电子工程学院
讲座名称 Millimeter-Wave Antennas and Arrays Using Printed-Circuit-Board and Plated-Through-Hole Technologies
讲座时间 2017-10-16 09:10:00
讲座地点 北校区科技楼学术报告厅
讲座人 Prof. Chi-Hou Chan (陈志豪), City University of Hong Kong, IEEE Fellow
讲座人介绍 Professor Chi Hou Chan received the B.S. and M.S. degrees in electrical engineering from the Ohio State University, Columbus, OH, USA, in 1981 and 1982, respectively, and the Ph.D. degree in electrical engineering from the University of Illinois, Urbana, IL, USA, in 1987. From 1987 to 1989, Dr. Chan was a Visiting Assistant Professor in the Department of Electrical and Computer Engineering at the University of Illinois.  He joined the Department of Electrical Engineering at the University of Washington, Seattle, USA as an Assistant Professor in 1989 and was promoted to Associate Professor with tenure in 1993. In 1996, he joined the Department of Electronic Engineering, City University of Hong Kong as a Professor, and was promoted to Chair Professor of Electronic Engineering in 1998. From 1998 to 2009, he was first Associate Dean and then Dean of College of Science and Engineering. He also served as Acting Provost of the university from July 2009 to September 2010. He is currently the Director of State Key Laboratory of Millimeter Waves, Partner Laboratory in the City University of Hong Kong.  His current research interests include computational electromagnetics, millimeter-wave circuits and antennas, and terahertz science and technology. Dr. Chan received the U.S. National Science Foundation Presidential Young Investigator Award in 1991 and the Joint Research Fund for Hong Kong and Macao Young Scholars, National Science Fund for Distinguished Young Scholars, China, in 2004. He received outstanding teacher awards from the Department of Electronic Engineering, CityU in 1998, 1999, 2000, and 2008.  He is the General Co-Chair of ISAP 2010, iWAT2011, iWEN 2013, ICCEM 2015, ICCEM 2016 and GSMM2017.
讲座内容
A new unlicensed high-band spectrum from 64 to 71 GHz has been added to the existing 57 to 64 GHz by the US Federal Communications Commission (FCC) in July 2016 for the fifth generation (5G) wireless connectivity in the US.  To cover 14 GHz absolute or 22 % relative bandwidth, it requires wideband antennas at millimeter-wave (MMW) band. In this talk, we will present our recent works on MMW antennas and arrays using printed-circuit-board (PCB) and plated-through-hole (PTH) technologies.  Our design strategies vary as we need to address the performance requirements, substrate choice, fabrication tolerance, feeding mechanism, and characterization method.  We first started with the implementation of linearly-polarized complementary-source antennas in the form of magneto-electric dipoles at MMW band, achieving impedance bandwidths of 43.9% and 29% (|S11| ≤ -10 dB) using single feed and differential feed, respectively.  For a waveguide-fed circularly-polarized complementary-source antenna, we obtained an impedance bandwidth of 23.8% and an axial ratio bandwidth of 23.4% with an overlapping bandwidth of 21.9%.  However, the fabrication tolerance of these antennas requires a precision of 0.01 mm.  To alleviate this difficulty, we proposed a differentially-fed, higher-order mode patch antenna in which 0.1 mm fabrication accuracy is needed at the cost of a slightly reduced impedance bandwidth to 18%.  At MMW frequency, the pin of the coaxial probe is tiny and the excitation of the antenna cannot be precisely positioned. One approach to eradicate the problem is to employ an aperture-coupled feed using double-layer PCB and substrate integrated waveguide (SIW).  Using this approach, new complementary-source antennas can be designed and easily adopted for high-gain array antennas.  These elements and arrays are less susceptible to fabrication tolerance and enjoy wideband operations.  Recent results on wideband elements and arrays covering 57-64 and 57-71 bands will be presented.
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