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Development of Millimeter-wave RFICs and LTCC Modules
时间:2017-10-10 10:35    点击:   所属单位:电子工程学院
讲座名称 Development of Millimeter-wave RFICs and LTCC Modules
讲座时间 2017-10-20 14:00:00
讲座地点 北校区图书馆西裙楼三楼学术报告厅
讲座人 Prof. Huei Wang
讲座人介绍
Huei Wang (S’83-M’87-SM’95-F’06) was born in Tainan, Taiwan, on March 9, 1958.  He received the B. S. degree in electrical engineering from Taiwan University, Taipei, Taiwan,  in 1980, and the M. S. and Ph. D. degrees in electrical engineering from Michigan State University, East Lansing, Michigan in 1984 and 1987, respectively.
During his graduate study, he was engaged in the research on theoretical and numerical analysis of electromagnetic radiation and scattering problems.  He was also involved in the development of microwave remote detecting/sensing systems.  Dr. Wang joined Electronic Systems and Technology Division of TRW Inc. since 1987.  He has been an MTS and Staff Engineer responsible for MMIC modeling of CAD tools, MMIC testing evaluation and design and became the Senior Section Manager of MMW Sensor Product Section in RF Product Center.  He visited the Institute of Electronics,  Chiao-Tung University, Hsin-Chu, Taiwan, in 1993 to teach MMIC related topics and returned to TRW in 1994.  He joined the faculty of the Department of Electrical Engineering of Taiwan University, Taipei, Taiwan,  as a Professor in February 1998.  He served as the Director of Graduate Institute of Communication Engineering of  Taiwan University from Aug. 2006 to July 2009.
Dr. Wang is a member of the honor society Phi Kappa Phi and Tau Beta Pi.  He was the Richard M. Hong Endowed Chair Professor of Taiwan University in 2005-2007.  He was elected as an IEEE Fellow in 2006, and has been appointed as an IEEE Distinguished Microwave Lecturer for the term of 2007-2009. 
 
讲座内容
In this talk, the development of millimeter-wave (MMW) RFICs in Taiwan University for the past years will be presented, including both GaAs and Si-based MMW MMICs for transceiver applications.  The design of the embedded MMW antennas/array by using multilayer substrates, can be either in low temperature cofired ceramic (LTCC) or low loss printed circuit board (PCB).  The short wavelength of MMW makes it possible to realize a MMW transceiver module with antenna array in the size of a typical IC package in size of few centimeters.  By embedding the antennas into suitable packaging substrate, for example, LTCC, and using flip-chip interconnect between die and substrate, a package with low loss at MMW frequency range can be realized.  The multi-layer structure of LTCC allows the radiation of antenna structure not only in planar direction, but also in vertical direction.
西安电子科技大学电子工程学院
超高速电路设计与电磁兼容教育部重点实验室
天线与微波技术重点实验室
国际交流与合作处
IEEE Xi'an Section, AP/MTT-Chapter
 
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